Plasma Treatment
Before Anything Else, Surface Preparation
Clean and Activate Surfaces to Enhance Flow and Adhesion
Plasma treatment removes impurities, activates surfaces, and improves wicking speed and flow, promoting void-free adhesion and encapsulation in conformal coating, advanced semiconductor packaging, and PCBA applications. When you prevent voids, you prevent corrosion, suppress dendrite growth, and protect against the daily use and abuse that undermines joint reliability.
Semiconductor Solutions
MARCH FlexTRAK® Series
FlexTRAK plasma treatment systems offer high-throughput, strip-type, and inline boat processing for advanced...
Learn moreMARCH StratoSPHERE™ Plasma Treatment System
The StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications....
Learn moreAP Batch Series
The AP Batch Series offers high-performance plasma treatment for batch manufacturing and R&D environments.
Learn moreStratoSPHERE
Printed Circuit Board Assembly Solutions
MARCH VIA™ Series
VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels....
Learn morePlasma Software
MARCH ProcessLINK Remote Control Software
ProcessLINK™ software adds bar code reading capabilities to the PlasmaLINK™ software package for Nordson MARCH's AP...
Learn moreMARCH PlasmaLINK Remote Control Software
PlasmaLINK™ is a remote-control software package enabling customers to remotely operate and collect data from Nordson...
Learn more